Teknicircuits, printed circuit board, pcb, prototype, printed circuit board fabricator, circuit boards, assembly, multi-layer, pcbs, prototype circuit boards, fast printed circuit boards, quick turn, electronic circuits, low cost circuit boards, custom printed circuit boards, No Touch PCB, NoTouch PCB, HDI circuits, Microelectronics PCB, MilSpec Circuits, Assembly services,
printed circuit board design printed circuit board repair printed circuit boards made rak printed circuit boards making printed circuit boards soldering printed circuit boards ipc printed circuit board printed circuit board fabrication
|A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly
PCBs are rugged, inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits, but are much cheaper and faster for high-volume production. Much of the electronics industry's PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.
Multi Wire boards
Multiwire is a patented technique of interconnection which uses machine-routed insulated wires embedded in a non-conducting matrix (often plastic resin). It was used during the 1980s and 1990s.
(Augat Inc., U.S. Patent 4,648,180)
Since it was quite easy to stack interconnections (wires) inside the embedding matrix, the approach allowed designers to forget completely about the routing of wires (usually a time-consuming operation of PCB design): Anywhere the designer needs a connection, the machine will draw a wire in straight line from one location/pin to another. This led to very short design times (no complex algorithms to use even for high density designs) as well as reduced crosstalk (which is worse when wires run parallel to each other--which almost never happens in
electronic circuit boards
circuit board fabrication and repair
how to solder multi-layer circuit boards
laser imaging printed circuit boards
printed circuit board design
printed circuit boards usa vendor
sierra circuits danbury ct
single layer printed circuit boards usa vendor
solutions used to attach the copper foil onto the printed circuit
through hole plating inc
though the cost is too high to compete with cheaper PCB technologies when large quantities are needed.
Main article: Surface-mount technology
Surface mount components, including resistors, transistors and an integrated circuit
Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labour costs and greatly increasing production and quality rates. Carrier Tapes provide a stable and protective environment for Surface mount devices
(SMDs) which may can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts. However, integrated circuits are often priced the same regardless of the package type, because the chip itself is the most expensive part. As of 2006, some wire-ended components, such as small-signal switch diodes, e.g. 1N4148, are actually significantly cheaper than corresponding SMD versions.
Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the
Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off.
In recent years, the use of surface mount parts has gained popularity as the demand for smaller electronics packaging and greater functionality has grown.