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| A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronic components is a printed circuit assembly (PCA), also known as a printed circuit board assembly
(PCBA).
PCBs are rugged, inexpensive, and can be highly reliable. They require much more layout effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits, but are much cheaper and faster for high-volume production. Much of the electronics industry's PCB design, assembly, and quality control needs are set by standards that are published by the IPC organization.
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Safety certification (US)
Safety Standard UL 796 covers component safety requirements for printed wiring boards for use as components in devices or appliances. Testing analyzes characteristics such as flammability, maximum operating temperature, electrical tracking, heat deflection, and direct support of live electrical parts.
The boards may use organic or inorganic base materials in a single or
multilayer, rigid or flexible form. Circuitry construction may include etched, die stamped, precut, flush press, additive, and plated conductor techniques. Printed-component parts may be used.
The suitability of the pattern parameters, temperature and maximum solder limits shall be determined in accordance with the applicable end-product construction and requirements.
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Originally, every electronic component had wire leads, and the PCB had holes drilled for each wire of each component. The components' leads were then passed through the holes and soldered to the PCB trace. This method of assembly is called through-hole construction. In 1949, Moe Abramson and Stanislaus F. Danko of the United States Army Signal Corps developed the
Auto-Sembly process in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today. Soldering could be done automatically by passing the board over a ripple, or wave, of molten solder in a wave-soldering machine. However, the wires and holes are wasteful since drilling holes is expensive and the protruding wires are merely cut off.
In recent years, the use of surface mount parts has gained popularity as the demand for smaller electronics packaging and greater functionality has grown.
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